Packaging Design Engineer - RF/Microelectronic Products

US - AZ - Tempe Ref #12153 16-May-2022

Job Description

One team. Global challenges. Infinite opportunities. At Viasat, we’re on a mission to deliver connections with the capacity to change the world. For more than 35 years, Viasat has helped shape how consumers, businesses, governments and militaries around the globe communicate. We’re looking for people who think big, act fearlessly, and create an inclusive environment that drives positive impact to join our team.

The Packaging Engineer position will entail all aspects of packaging development from planning, designing, developing advanced/novel packaging, and managing packaging efforts for RF communication products. The products range from IC’s, System In Packages, sub-assemblies, and modules. The packaging development process includes package definition, stack-up, substrate layout, bond diagram, drawings, modeling and simulation, technical risk/cost assessment, materials and process characterization, compilation of formal documentation, interfacing with sub-contractors and internal assembly and reliability resources, and final release of product.

Job Responsibilities

In this position you will work closely with project development teams and product groups (RFIC, MMIC, Module) to develop the next generation/advanced/novel packaging solution for RF communication products, Define packages and materials that meet product requirements for reliability, performance, manufacturability, and cost. You will also ensure all packaging deliverables are met for New Product and New Technology Introductions, develop, and manage packaging documentation including SOWs, package drawings, and process flows. You will design and layout of semiconductor packages including QFN, SiP, WL-CSP, RDL, Flip Chip, FO-WLP and Interposers.

Requirements

  • 10+ years in semiconductor packaging including experience in package assembly process, package engineering, quality & reliability and the intersection/relationship of packaging to test.
  • Deep understanding of micro-electronic package structure, mechanical, electrical and thermal performance.
  • Strong understanding of heat transfer and its relation to material properties
  • Packaging knowledge in RFIC, millimeterware, System In Package, sub-assembly, and/or modules.
  • Experience in semiconductor package design with demonstrated experience in one or more of the following:  QFN, SiP, BGA, WL-CSP, Flip Chip and Bumping or FO-WLP
  • Strong understanding of Die Prep, Assembly (die attach, Wirebond, flip chip, etc) and Surface Mount Technology (SMT) process-equipment is desired.
  • Have a high tolerance for ambiguity and solid communication skills
  • Strong understanding of interconnect reliability daisy chain testing, CPI and BLR.
  • Understands the metallization schemes for laminates, interposers and SMT.
  • Knowledge of statistical methods and Design of Experiments
  • Must be able to work autonomously and help determine methods and procedures. 
  • Customer service oriented.
  • Ability to work with design teams to translate IC/system requirements input packaging configurations
  • Ability to manage and drive packaging
  • Bachelor's Degree in Electrical, Mechanical, Materials Engineering or related technical discipline
  • US Government position. US Citizenship required
  • Ability to travel up to 10%

Preferences

  • Strong Preference for RF, Microwave or mmWave experience
  • Experience with package design tools such as Cadence APD/SiP
  • Experience with schematic capture and design tools such as Cadence Concept HDL, Mentor Graphics DxDesigner, or Zuken
  • Prior volume OSAT experience is highly desired
  • Experience in ITAR and Mil programs
  • SolidWorks tool usage
  • Knowledge or exposure of wafer to wafer bonding
  • Knowledgeable about ATE 
  • IMAPs and/or MEPTEC membership
  • Stays current on semiconductor packaging trends
  • Understands MIL-STD-883 and JEDEC requirements
  • Proficient user of Microsoft Excel and other Office products
***This position will be located in Tempe, AZ***

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Additional Requirements and Information

Minimum Education
Bachelors Degree
Years of Experience
Other
Travel
Up to 10%
Citizenship
US Citizenship required
Clearance
None
Worker Classification
Employee

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Viasat is proud to be an equal opportunity employer, seeking to create a welcoming and diverse environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, ancestry, physical or mental disability, medical condition, marital status, genetics, age, or veteran status or any other applicable legally protected status or characteristic.

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